The MULTIPLE project will strengthen EU photonics manufacturing base. Cost-efficiency, flexibility, high productivity and quality attained thanks to MULTIPLE solutions will allow laser, optical measurement and image processing equipment, companies in Europe to compete glob ally through a breakthrough technology in manufacturing, thus benefiting from business opportunities in fast growing markets.

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Dual aperture VIS/SWIR snapshot HSI

MULTIPLE is developing a dual-aperture HSI broadband camera covering the VIS and SWIR. This system combines two camera cores, one CMOS and one InGaAs, on a single frame. Exploiting a dual aperture approach – one aperture for the visible range and the other for the SWIR range – and embedded capabilities for computational imaging, MULTIPLE will build a new camera capable of snapshot computational imaging in a broad spectral range, from 0.4 to 1.7 µm wavelength.

The camera will integrate a SoC embedded system for synchronized acquisition from the two cores and embedded processing. Embedded real-time image reconstruction algorithms will be developed for radiometric calibration and de-mosaic. This involves the reconstruction of the hyperspectral datacube for each broadband, VIS and SWIR independently.

Besides, broadband registration of the VIS and SWIR datacubes will be implemented, providing a unique stream of VIS-SWIR HSI data at maximum frame rate.

Following this approach, optical performance – a key factor of HSI performance – may be easily and flexibly optimized for each aperture. Moreover, this will be possible with off-the-shelf and compact optical components, at a fairly low-cost. This is key to keep the final imager cost effective and compact, unlike bulky and expensive prism-based optics. Therefore, MULTIPLE will bring a compact and cost effective broadband dual aperture camera, capable of snapshot hyperspectral imaging in the VIS/SWIR range.